Data for reference lee-jvstb-14-3537Etching processes for fabrication of GaN/InGaN/AlN microdisk laser structures
JW Lee, CB Vartuli, CR Abernathy, JD MacKenzie, JR Mileham, SJ Pearton, RJ Shul, JC Zolper, M Hagerott-Crawford, JM Zavada, RG Wilson, RN Schwartz
Journal of Vacuum Science and Technology B 14(6), 3537 (1996).
InxGa1-xN alloys (x up to 0.75) was selective etched using KOH-based wet etch solutions. The etching rate was strongly depended on material quality.
This item cites the following items in the database:
- InGaN-Based Multi-Quantum-Well-Structure Laser Diodes
- Deposition of highly resistive, undoped, and p-type, magnesium-doped gallium nitride films by
modified gas source molecular beam epitaxy
- Ion-implanted GaN junction field effect transistor
- Large-band-gap SiC, III-V nitride, and II-VI ZnSe-based semiconductor device technologies
- AlGaN ultraviolet photoconductors grown on sapphire
- Room-temperature stimulated emission in GaN/AlGaN separate confinement heterostructures grown
by molecular beam epitaxy
- Room-temperature photoenhanced wet etching of GaN
- Electron cyclotron resonance etching characteristics of GaN in SiCl4/Ar
- Characteristics of chemically assisted ion beam etching of gallium nitride
- High temperature electron cyclotron resonance etching of GaN, InN, and AlN
- Ecr Plasma Etching of GaN, AlN and Inn Using Iodine or Bromine Chemistries
Contributed by A.E. Nikolaev from www-proxy.ioffe.rssi.ru. on Sunday, February 9, 1997 2:16:53 PM
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