Tables
Table 1
Comparison of room temperature PEC etch rates for GaN and AlN under Hg arc illumination.
|
Electrolyte
|
Concen.
|
Iph
[µA]
|
GaN etch rate [nm/min]
|
AlN etch rate [nm/min]
|
|
KOH
|
0.02 M
|
150
|
42
|
0
|
|
KOH
|
0.04 M
|
150
|
51
|
0
|
|
H3PO4:H2O
|
1:25
|
40
|
21
|
0
|
|
H3PO4:H2O
(NID GaN)
|
2:25
|
60
|
33
|
0
|
|
H3PO4:H2O
(~1E19 cm-2 GaN)
|
2:25
|
60
|
83
|
0
|
|
HCl:H2O
|
1:10
|
600
|
0
|
0
|
|
H2SO4:H2O
|
1:25
|
20
|
0
|
0
|
|
B4K2O7
|
0.1 M
|
175
|
0
|
-
|
|
B4Na2O7
|
0.1 M
|
175
|
0
|
-
|
|
C4H6O6:NaOH):H2O
|
2:100
|
30
|
0
|
-
|
|
HBrpH=0.67):H2O
|
2:100
|
45
|
0
|
-
|
last updated Wednesday, December 8, 2004 12:52:45 PM.© 2004 The Materials Research Society
