Growth of Semi-insulating GaN Layer by Controlling Size of Nucleation Sites for SAW Device Applications
Jae-Hoon Lee, Myoung-Bok Lee, Sung-Ho Hahm, Yong-Hyun Lee, Jung-Hee Lee
School of Electronic Engineering and Computer Science, Kyungpook National University, Daegu 702-701, Korea
Young- Ho Bae
Division of Information and Electronics, Uiduk University, Gyeongju 780-910, Korea
Hyun Kyung Cho
Department of Metallurgical Engineering, Dong-A University, Busan, 604-717, Korea
This article was received on Friday, July 4, 2003 and
accepted on Wednesday, August 13, 2003. Abstract
Semi-insulating
undoped GaN films were grown based on controlling the size of the nucleation
sites through a special two-step growth method: First, 16 nm LT-GaN was
annealed at 950 ° with a ramping time of 4 min, then the GaN was grown
at this temperature for 1 min. Second, the growth temperature was increased to
1020° with a ramping time of 2 min and the GaN layer finally grown at
1020 ° for 40 min. The film grown by this sequence exhibited sheet
resistance of up to 109
/sq with mirror-like surface
morphology. By slow ramping to 950° in the initial phase of growth,
smaller grain sizes and higher nuclei densities were formed and the columnar
growth mode along the c direction was dominant. The observation of higher
resistance in two-step growth is believed due to the increased misorientation
of nuclei when the growth proceeds during temperature ramping to 1020°.
The fabricated saw filter on semi-insulating GaN exhibited a high velocity of
5342 m/s at center frequencies of 133.57 MHz and an electromechanical coupling
coefficient(k2) of about 0.763 %, which was
enhanced due to the improvement of surface morphology with high sheet
resistance by the two- step ramping technique.Outline
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Cite this article as: MRS Internet J. Nitride Semicond. Res. 8, 5(2003).
last updated Wednesday, December 8, 2004 5:02:39 PM.© 2003-2004 The Materials Research Society
