High Temperature Elastic Constant Prediction of Some Group III-Nitrides
Robert R. Reeber, Kai Wang
Department of Materials Science and Engineering, North Carolina State University
This article was received on Tuesday, January 9, 2001 and
accepted on Thursday, January 25, 2001. Abstract
Thermoelastic properties are important for modeling thermal residual
stresses and for optimizing the growth conditions of semiconductor thin films.
Thermal expansions of AlN and GaN have been evaluated and predicted by us
earlier [1] [2]. Here, high temperature elastic constants are estimated
empirically from corresponding state relationships and data from other
hexagonal Grimm-Sommerfeld compounds. This information together with our
earlier thermal expansion data will further improve capabilities for
calculating thermal residual stresses in various semiconductor thin
films.Outline
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Cite this article as: MRS Internet J. Nitride Semicond. Res. 6, 3(2001).
last updated Tuesday, January 30, 2001 10:44:45 PM.© 2001 The Materials Research Society
