Fabrication and Characterization of GaN Junction Field Effect Transistors


Lei Zhang
Sandia National Laboratories

Luke F. Lester
University of New Mexico

Albert G. Baca, Randy J. Shul, Ping C. Chang, Christi G. Willison
Sandia National Laboratories

Umesh K. Mishra, Steve P. Denbaars
University of California, Santa Barbara

John C. Zolper
Office of Naval Research

This article was presented as part of Symposium W, "Gallium Nitride and Related Alloys" at the 1999 Fall Meeting of the Materials Research Society held in Boston, Massachusetts, November 28-December 3

Abstract

Junction field effect transistors (JFET) were fabricated on a GaN epitaxial structure grown by metal organic chemical vapor deposition. The DC and microwave characteristics, as well as the high temperature performance of the devices were studied. These devices exhibited excellent pinch-off and a breakdown voltage that agreed with theoretical predictions. An extrinsic transconductance (gm) of 48 mS/mm was obtained with a maximum drain current (ID) of 270 mA/mm. The microwave measurement showed an fT of 6 GHz and an fmax of 12 GHz. Both the ID and the gm were found to decrease with increasing temperature, possibly due to lower electron mobility at elevated temperatures. These JFETs exhibited a significant current reduction after a high drain bias was applied, which was attributed to a partially depleted channel caused by trapped electrons in the semi-insulating GaN buffer layer.

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Cite this article as: MRS Internet J. Nitride Semicond. Res. 5S1, W4.9 (2000).


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MRS Internet Journal of Nitride Semiconductor Research
last updated Wednesday, May 17, 2000 4:55:50 PM.
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