Processing And Device Performance Of GaN Power Rectifiers


A.P. Zhang, G.T. Dang, X.A. Cao, H. Cho, F. Ren
University of Florida

J. Han
Sandia National Laboratories

J.-I. Chyi, C.-M. Lee, T.-E. Nee, G.-C. Chi, C.-C. Chuo
National Central University

S.N.G. Chu
Bell Laboratories, Lucent Technologies

R.G. Wilson
Consultant, Stevenson Ranch CA

S. J. Pearton
University of Florida

This article was presented as part of Symposium W, "Gallium Nitride and Related Alloys" at the 1999 Fall Meeting of the Materials Research Society held in Boston, Massachusetts, November 28-December 3

Abstract

Mesa and planar geometry GaN Schottky rectifiers were fabricated on 3-12xm thick epitaxial layers. In planar diodes utilizing resistive GaN, a reverse breakdown voltage of 3.1 kV was achieved in structures containing p-guard rings and employing extension of the Schottky contact edge over an oxide layer. In devices without edge termination, the reverse breakdown voltage was 2.3 kV. Mesa diodes fabricated on conducting GaN had breakdown voltages in the range 200-400 V, with on-state resistances as low as 6mOmegacm-2 .

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Cite this article as: MRS Internet J. Nitride Semicond. Res. 5S1, W11.67 (2000).


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MRS Internet Journal of Nitride Semiconductor Research
last updated Wednesday, May 17, 2000 5:01:28 PM.
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