Figures

Figure 1

Schematic of GaN/AlGaN p-i-n photodiode structure.

Figure 2

Nomarski photograph of photodiode array and Si ROIC with deposited In bumps.

Figure 3

Hybridized focal plane array imager mounted and wirebonded to 84 pin leadless chip carrier.

Figure 4

(a) UV FPA chip assembly mounted in LCC socket in UV camera head; (b) Camera head with quartz UV optics installed.

Figure 5

Two views of NCSU UV camera.

Figure 6

Spectral responsivity of discrete (200 µm x 200 µm) GaN/AlGaN heterostructure photodiode operating in the photovoltaic mode (zero bias).

Figure 7

Comparison of alpha-numeric images obtained using a 32x32 UV FPA versus a 128x128 UV FPA.

Figure 8

Comparison of geometric images obtained using a 32x32 UV FPA versus a 128x128 UV FPA.

Figure 9

Visible (top) and UV (320-365 nm) visible-blind image of TIG arc welder.

Figure 10

Visible (top) and UV (320-365 nm) visible-blind image of oxy-acetylene torch.

© 2000 The Materials Research Society