Tables
Table I
Boiling points for possible etch products of Group-III nitride films etched in halogen- or CH4/H2-based plasmas.
|
Etch Products
|
Boiling Points (°C)
|
|
AlCl3
|
183
|
|
AlF3
|
na
|
|
AlI3
|
360
|
|
AlBr3
|
263
|
|
(CH3)3Al
|
126
|
|
GaCl3
|
201
|
|
GaF3
|
1000
|
|
GaI3
|
sublimes 345
|
|
GaBr3
|
279
|
|
(CH3)3Ga
|
55.7
|
|
InCl3
|
600
|
|
InF3
|
>1200
|
|
InI3
|
na
|
|
InBr3
|
sublimes
|
|
(CH3)3In
|
134
|
|
NCl3
|
<71
|
|
NF3
|
-129
|
|
NBr3
|
na
|
|
NI3
|
explodes
|
|
NH3
|
-33
|
|
N2
|
-196
|
|
(CH3)3N
|
-33
|
Table II
Summary of etch rate results for GaN, AlN and InN with different plasma chemistries in different techniques.
|
Gas
Chemistry
|
Etching
Technique
|
Etch rate (nm/min) at given bias
|
|
|
|
GaN
|
ref
|
|
AlN
|
ref
|
|
InN
|
ref
|
|
SiCl4 [w/Ar, SiF4]
|
RIE
|
55
|
-400 V
|
[6]
|
-
|
-
|
|
-
|
-
|
|
|
BCl3
|
RIE
|
105
|
-230 V
|
[6]
|
-
|
-
|
|
-
|
-
|
|
|
HBr [w/Ar, H2]
|
RIE
|
60
|
-400 V
|
[6]
|
-
|
-
|
|
-
|
-
|
|
|
CHF3, C2ClF5
|
RIE
|
45
|
500 W
|
[5]
|
-
|
-
|
|
-
|
-
|
|
|
SF6
|
RIE
|
17
|
-400 V
|
[6]
|
-
|
-
|
|
-
|
-
|
|
|
CHF3, C2ClF5
|
RIE
|
60
|
-500 V
|
[6]
|
-
|
-
|
|
-
|
-
|
|
|
BCl3/Ar
|
ECR
|
30
|
-250 V
|
[5]
|
17
|
-250 V
|
[5]
|
17
|
-300 V
|
[5]
|
|
CCl2F2/Ar
|
ECR
|
20
|
-250 V
|
[5]
|
18
|
-300 V
|
[5]
|
18
|
-300 V
|
[5]
|
|
CH4/H2/Ar
|
ECR
|
40
|
-250 V
|
[5]
|
2.5
|
-300 V
|
[5]
|
10
|
-300 V
|
[5]
|
|
Cl2/H2/Ar
|
ECR
|
200
|
-180 V
|
[8]
|
110
|
-150 V
|
[8]
|
150
|
-180 V
|
[8]
|
|
SiCl4/Ar
|
ECR
|
95
|
-280 V
|
[8]
|
-
|
-
|
|
-
|
-
|
|
|
Hl/H2
|
ECR
|
110
|
-150 V
|
[5]
|
120
|
-150 V
|
[5]
|
100
|
-150 V
|
[7]
|
|
HBr/H2
|
ECR
|
70
|
-150 V
|
[5]
|
65
|
-150 V
|
[5]
|
17
|
-150 V
|
[5]
|
|
ICl/Ar
|
ECR
|
1300
|
-275 V
|
[5]
|
200
|
-272 V
|
[5]
|
1150
|
-275 V
|
[5]
|
|
IBr/Ar
|
ECR
|
300
|
-170 V
|
[12]
|
160
|
-170 V
|
[5]
|
325
|
-170 V
|
[12]
|
|
BCl3
|
M-RIE
|
350
|
<-100 V
|
[10]
|
125
|
<-100 V
|
[5]
|
100
|
<-100 V
|
[10]
|
|
Cl2/H2/Ar
|
ICP
|
688
|
-280 V
|
[8]
|
-
|
-
|
|
-
|
-
|
|
|
Cl2/Ar
|
ICP
|
980
|
-450 V
|
[8]
|
670
|
-450 V
|
[8]
|
150
|
-100 V
|
[8]
|
|
Cl2/N2
|
ICP
|
65
|
-100 V
|
[8]
|
39
|
-100 V
|
[8]
|
30
|
-100 V
|
[8]
|
|
BBr3
|
ICP
|
150
|
-380
|
[5]
|
50
|
-200
|
[5]
|
500
|
-380
|
[5]
|
|
BI3
|
ICP
|
200
|
-175
|
[5]
|
100
|
-175
|
[5]
|
700
|
-240
|
[5]
|
|
Icl
|
ICP
|
30
|
-300
|
[5]
|
30
|
-300
|
[5]
|
600
|
-300
|
[5]
|
|
Ibr
|
ICP
|
20
|
-300
|
[5]
|
30
|
-300
|
[5]
|
600
|
-300
|
[5]
|
|
Ar ion
|
Ion milling
|
110
|
500 eV
|
[5]
|
29
|
500 eV
|
[5]
|
61
|
500 eV
|
[5]
|
|
Cl2 [Ar ion]
|
CAIBE
|
210
|
500 eV
|
[6]
|
62
|
500 eV
|
[6]
|
-
|
-
|
|
|
HCl[Ar ion]
|
CAIBE
|
190
|
500 eV
|
[6]
|
-
|
-
|
|
-
|
-
|
|
|
Cl2
|
RIBE
|
150
|
500 eV
|
[5]
|
-
|
-
|
|
-
|
-
|
|
|
HCl
|
RIBE
|
130
|
500 eV
|
[5]
|
-
|
-
|
|
-
|
-
|
|
|
Cl2/Ar
|
RIBE
|
50
|
-400
|
[5]
|
50
|
-400
|
[5]
|
80
|
-400
|
[5]
|
|
HCl
|
Photoassisted
|
0.04Å/pulse
|
[6]
|
-
|
-
|
|
-
|
-
|
|
|
H2, Cl2
|
LE4
|
50-70
|
1-15 eV
|
[9]
|
-
|
-
|
|
-
|
-
|
|
last updated Wednesday, November 22, 2000 3:02:50 PM.© 2000 The Materials Research Society
