Figure 22

AES surface scans of GaN (a) before exposure to the plasma, (b) at 65 W (-120 V bias) and (c) 275 W rf-cathode power (-325 V bias), 1 mTorr, 170°C, and 850 W microwave power in an ECR-generated Cl2/H2 discharge.


top        text     Figure 21     Figure 23        endnotes

last updated Wednesday, November 22, 2000 3:01:33 PM.

© 2000 The Materials Research Society MRS Internet Journal of Nitride Semiconductor Research