Temperature Dependence of Bound Exciton Emissions in GaN


D.G. Chtchekine, G.D. Gilliland
Emory University

Z.C. Feng
Institute of Material Research and Engineering

S.J. Chua
Institute of Materials Research and Engineering

D.J. Wolford
Iowa State University

S.E. Ralph
Georgia Institute of Technology

M.J. Schurman, I. Ferguson
Emcore Corporation

This article was presented as part of Symposium G, "Gallium Nitride and Related Alloys" at the 1998 Fall Meeting of the Materials Research Society held in Boston, Massachusetts, November 30-December 4.

Abstract

The dissociation channels of two prominent bound exciton complexes in wurtzite GaN thin films are determined via an extensive temperature dependent photoluminescence study. The shallow donor bound exciton dissociation at low temperatures (T <= 50 K) is found to be dominated by the release of a free exciton with thermal activation energy consistent with the exciton localization energy. At higher temperatures a second dissociation channel with activation energy EA = 28 ± 2 meV is observed. The dissociation of a bound exciton complex with exciton localization energy E Xloc = 11.7 meV is also dominated by the release of a free exciton. In contrast to previous studies evidence is presented against the hypothesis of this emission being due to the exciton bound to an ionized donor. We find that it originates most likely from an exciton bound to a neutral acceptor.

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Cite this article as: MRS Internet J. Nitride Semicond. Res. 4S1, G6.47 (1999).


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MRS Internet Journal of Nitride Semiconductor Research
last updated Saturday, April 3, 1999 2:44:00 AM.
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