W.Y. Ho, W.K. Fong, Charles Surya, K.Y. Tong
The Hong Kong Polytechnic University
L.W. Lu
The Hong Kong University of Science and Technology and Chinese Academy of Sciences
W.K. Ge
The Hong Kong University of Science and Technology
This article was presented as part of Symposium G, "Gallium Nitride and Related Alloys" at the 1998 Fall Meeting of the Materials Research Society held in Boston, Massachusetts, November 30-December 4.
We report experiments on hot-electron stressing in commercial III-V nitride based heterojunction light-emitting diodes. Stressing currents ranging from 100 mA to 200 mA were used. Degradations in the device properties were investigated through detailed studies of the I-V characteristics, electroluminescence, Deep-Level Transient Fourier Spectroscopy and flicker noise. Our experimental data demonstrated significant distortions in the I-V characteristics. The room temperature electroluminescence of the devices exhibited 25% decrement in the peak emission intensity. Concentration of the deep-levels was examined by measuring the Deep-Level Transient Fourier Spectroscopy, which indicated an increase in the density of deep-traps from 2.7 x 1013 cm-3 to 4.21 x 1013 cm-3 at E1= EC- 1.1eV. The result is consistent with our study of 1/f noise, which exhibited up to three orders of magnitude increase in the voltage noise power spectra. Our experiments show large increase in both the interface traps and deep-levels resulted from hot-carrier stressing.
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Cite this article as: MRS Internet J. Nitride Semicond. Res. 4S1, G6.4 (1999).
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