Pinholes, Dislocations and Strain Relaxation in InGaN


B. Jahnen, M. Albrecht, W. Dorsch, S. Christiansen, H. P. Strunk
Institut für Werkstoffwissenschaften, Lehrstuhl VII, Universität Erlangen-Nürnberg

D. Hanser, Robert F. Davis
Department of Materials Science and Engineering, North Carolina State University

This article was received on Friday, July 17, 1998 and accepted on Monday, October 19, 1998.

Abstract

We analyse by means of transmission electron microscopy (TEM) and atomic force microscopy (AFM) the strain relaxation mechanisms in InGaN layers on GaN as dependent on the In content. At the experimentally given thickness of 100 nm, the layers remain coherently strained, up to an In concentration of 14 %. We show that part of the strain is reduced elastically by formation of hexagonally facetted pinholes. First misfit dislocations are observed to form at pinholes that reach the InGaN/GaN interface. We discuss these results in the framework of the Matthews-Blakeslee model for the critical thickness considering the Peierls force for glide of threading dislocations in the different slip systems of the wurtzite lattice.

Outline

  • Introduction
  • Experiment
  • Results
  • Discussion
  • Elastic Relaxation
  • Plastic Relaxation
  • Summary
  • Acknowledgments
  • Appendix 1 Equations used for the calculation of the critical thickness
  • Linked Pages

    Cite this article as: MRS Internet J. Nitride Semicond. Res. 3, 39(1998).

    last updated Monday, October 19, 1998 1:09:59 PM.

    © 1998 The Materials Research Society MRS Internet Journal of Nitride Semiconductor Research
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